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Thursday, March 4, 2010

Scholarship Opportunity for Com Design Majors Interested in Pursuing Careers in Package Design

The Com Design faculty received this from Chris Cole earlier this afternoon. Thanks for passing this information along, Chris.

Institute of Packaging Professionals

Naperville, IL

Packaging Education Scholarship Fund:

The IoPP is proud to offer four $2,500 academic scholarships for 2010-2011 to recognize exceptional college students headed for a career in packaging.

Eligibility:

Candidates must be students in their Junior or Senior year, pursuing a degree at an accredited college, university or vocational/technical school in a course of study relevant to a career in the packaging industry.

Deadline for applications April 15, 2010.

Details at: http://www.iopp.org/scholarshipfund